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Package Information
Vishay Siliconix
TO-263AB (HIGH VOLTAGE)
A
(Dat u m A)
3
4
A
A
B
E
c2
4
L1
4
Ga u ge
H
plane
0° to 8 °
B
D
L2
B
1
B
2
C
3
C
H
5
Detail A
L3
L
L4
Detail “A”
Rotated 90° CW
scale 8 :1
A1
Seating plane
2 x b 2
2x b
c
A
2xe
0.010 M A M B
± 0.004 M B
E
Base
Plating
(c)
5
b 1, b 3
metal
5
c1
D1
4
( b , b 2)
Lead tip
MILLIMETERS
Section B - B and C - C
Scale: none
INCHES
E1
V ie w A - A
MILLIMETERS
4
INCHES
DIM.
A
A1
b
MIN.
4.06
0.00
0.51
MAX.
4.83
0.25
0.99
MIN.
0.160
0.000
0.020
MAX.
0.190
0.010
0.039
DIM.
D1
E
E1
MIN.
6.86
9.65
6.22
MAX.
-
10.67
-
MIN.
0.270
0.380
0.245
MAX.
-
0.420
-
b1
0.51
0.89
0.020
0.035
e
2.54 BSC
0.100 BSC
b2
b3
c
c1
1.14
1.14
0.38
0.38
1.78
1.73
0.74
0.58
0.045
0.045
0.015
0.015
0.070
0.068
0.029
0.023
H
L
L1
L2
14.61
1.78
-
-
15.88
2.79
1.65
1.78
0.575
0.070
-
-
0.625
0.110
0.066
0.070
c2
1.14
1.65
0.045
0.065
L3
0.25 BSC
0.010 BSC
D
8.38
9.65
0.330
0.380
L4
4.78
5.28
0.188
0.208
ECN: S-82110-Rev. A, 15-Sep-08
D W G: 5970
Notes
1. Dimensioning and tolerancing per ASME Y14.5M-1994.
2. Dimensions are shown in millimeters (inches).
3. Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at the
outmost extremes of the plastic body at datum A.
4. Thermal PAD contour optional within dimension E, L1, D1 and E1.
5. Dimension b1 and c1 apply to base metal only.
6. Datum A and B to be determined at datum plane H.
7. Outline conforms to JEDEC outline to TO-263AB.
Document Number: 91364
Revision: 15-Sep-08
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